Cronologic Ndigo Crate Manual do Utilizador Página 9

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Key Features
t
I
n
d
ustr
i
a
l
-gra
d
e
X
ilinx
S
partan-3A D
S
P FP
G
A module
(
1800 k gates or 3400 k gates
)
t
US
B 2.0
(
Hi-
S
peed U
S
B
)
inter
f
ace with a signaling bit rate o
f
u
p to 480 Mb
/
s
t
3
2-bit wide 1
G
bit
D
DR
S
DRAM
t
F
P
G
A configuration through:
t
B
2
B
connector
t
J
TA
G
port
t
S
PI Flash memory
t
L
arge
S
PI Flash memory
(
for configuration and operation
)
a
ccess
ibl
e t
h
roug
h
:
t
B
2B connector
(S
PI direct
)
t
F
P
G
A
t
J
TA
G
port
(S
PI indirect
)
t
US
B bus
(
Firmware Upgrade Tool
)
t
O
n-board 100 MHz oscillator for high performance
t
O
n-board 24 MHz oscillator available to user
t
3
on-board high-power, high-efficiency, switch-mode D
C
-D
C
c
onverters capable o
f
3 A each
t
P
ower supp
l
y range: 4.0 - 7.0
V
t
P
ower supply via U
S
B or B2B
(
carrier board
)
t
1
09 FP
G
A I
/O
pins
(
plus 10 dual-purpose pins
)
available on
B
2
B
connectors
t
4
LED
s, 2 pus
h
b
uttons, 8
DIP
sw
i
tc
h
es.
Development Suite
A hardware development plat
f
orm is available. Latest
documentation, design support
les and so
f
tware developmen
t
suite are available
f
or download
f
ree o
f
charge
:
t
U
ser manua
l
, app
li
cat
i
on note
s
t
S
chematics, assembly diagrams,
C
AD library file
s
t
U
S
B 2.0 and DDR
S
DRAM data communication API
s
t
Device drivers,
rmware
t
IP-cores
(
DMA, EZ-U
S
B, I2
C)
t
Programming tools
(S
PI Flash
)
t
Re
f
erence bit-stream
s
t
Re
f
erence design
s
t
Reference Xilinx MicroBlaze system
(
EDK
).
e
ngineered for free Xilinx W
eb
PA
C
K embedded
p
rocesso
r
USB controller by
U
S
B 2.0 b
y
Assembly Options
p
art numbe
r
M
g
ate
s
p
owe
r
TE
03
2
0
-
00
-EV
01
1.
8
US
B
TE
0320-00-
EV
02 1.8
B
2
B
T
E
03
2
0
-
00
-EV
0
2
B
3
.4 B2B
C
ustom assembly options for cost or performance optimization
are ava
il
a
bl
e upon request
.
www.trenz-electronic.de
/
te032
0
9
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