
bit
128 Mbyte
DR3
DRA
bit
128 Mb
te
DR3
DRA
it
1
it
-1
x xs
stem I
s
52 x diff. I
5
+1
x s.e. I/O
Gigabit Ethernet
s
ca
ayer
JTA
FU
E
64
8 Mbyte
Quad-SP
er
a
as
48-bit EPR
MAC address)
sw
tc
n
e
u
ator
sw
tc
n
egu
ator
lin
r
re
ulato
watc
o
.
.5
.2
2.
r
2
z
i
.
.
25
t
PHY
Xilinx FP
partan-6 L
2
5*
00*
Key Features
n
ustr
a
-gra
e
5
0
100
1000
bit Ethernet transceiver
PHY
× 16-bit-wide 1
bit-large
DR3
DRAM
arge
PI Flash memory
for configuration and operation
ccess
e t
roug
:
2B connector
PI direct
P
A
TA
port
PI indirect
ga
t
t
ernet transce
ver
P
A configuration through:
2
connector
TA
port
PI Flash memory
p to
erent
a
up
o
s
ng
e-en
e
+ 1 dual-
urpose
FP
A I
pins available on B2B strips
ug-on mo
u
e w
t
two 100-p
n
g
-spee
ermap
ro
t
c
tac
ng str
ps
.0
x 1.2
power ra
.0
x 1.5
power ra
25 MHz re
erence clock signal
FU
E bit-stream encryption
LX100 or larger
user
venly-spread supply pins
or good signal integrity
ootprint for single-ended custom oscillator
optional
Development Suite
A hardware development plat
orm is available. Latest
documentation, design support
les and so
tware development
suite are available
or download
ree o
charge
ser manua
, app
cat
on note
chematics, assembly diagrams,
AD library file
rmware
IP-cores
DMA, 1-Wire
Programming tools
PI Flash
Re
erence bit-stream
Re
erence design
Reference Xilinx MicroBlaze system
EDK
Assembly Options
m
l
l
k lo
ic cell
MA
E
LX4
0600
100 101 18
E
LX1
71
ustom assembly options for cost or performance optimization
are ava
a
e upon request
engineered for free Xilinx W
PA
embedded
rocesso
www.trenz-electronic.de
te060
7
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